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Transforming Advanced Manufacturing with the Power of Lasers
ABOUT US
Advancete is a research and development intensive UK-based company specialising in applied laser solutions for advanced manufacturing. Advancete aims to revolutionise dicing and drilling of thick and brittle wafers in semiconductor manufacturing and expand the use of commercial-off-the-shelf (COTS) electronics in extreme environments through cutting-edge laser processing solutions. Focused at the semiconductors and electronics industries, Advancete has developed two patent protected novel technology solutions which have been successfully tested and demonstrated.
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About
OUR SOLUTIONS
AquaLase®
A laser processing solution, that utilises active liquid cooling, for dicing and drilling thick and brittle wafers. AquaLase® has demonstrated that it is feasible to significantly improve the production yield for devices made from thick and brittle wafers such as those made from LiNbO3, LiTaO3, SiC, GaN and Glass wafers. This significant improvement is achieved by the elimination of cut-edge chipping and collateral damage such as fracturing of surrounding material.
UltraSleeve®
A laser-based encapsulation process utilising ultrahard materials, such as Diamond and Boron Nitride, for protecting commercial-off-the-shelf components or systems for applications in extreme environments. UltraSleeve® provides mechanical robustness, chemical resistance, high thermal conductivity, high radiation hardness and shielding.
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