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AquaLase®
Maximise. Every. Wafer.
High-yield, low-damage laser processing for advanced materials
AquaLase enables high-yield, low-damage laser processing for advanced semiconductor and photonics materials, reducing cracking, minimising thermal stress, and improving precision at scale.
AquaLase
Our Vision
AquaLase is redefining precision laser processing for advanced materials, enabling manufacturers to achieve higher yield, lower damage, and greater process reliability across next-generation semiconductor and photonics applications.
With proprietary, patent pending liquid-assisted laser processing technology, AquaLase addresses some of the most critical yield and damage challenges in advanced semiconductor and photonics manufacturing. Designed for next-generation materials including compound semiconductors, wide bandgap, and other difficult-to-process wafers, our technology enables cleaner cuts, reduced thermal stress, minimal edge chipping, and improved process reliability.
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Built as a flexible solution compatible with existing laser platforms, AquaLase helps manufacturers improve precision, reduce waste, and maximise production yield without compromising scalability. Our approach combines advanced thermal management with high-precision laser processing to unlock capabilities beyond conventional mechanical and laser-based methods.
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As global demand for advanced semiconductors, photonics devices, and high-performance materials continues to accelerate, AquaLase is positioned to support the future of precision manufacturing through innovative, high-yield, low-damage processing solutions.
Our Technology
Precision Without Compromise
AquaLase is a proprietary liquid-assisted platform for laser processing, designed to reduce stress-induced damage during high-speed machining of advanced semiconductor and photonics materials.
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By stabilising thermal gradients during laser-material interaction, AquaLase enables cleaner, lower-damage processing with improved yield, precision, and process reliability across difficult-to-process wafers and multilayer structures.
Reduced Cracking
Minimises stress-induced wafer cracking during high-speed laser processing.
Minimal Edge Chipping
Enables cleaner edges and improved feature quality across brittle materials.
Multilayer Compatibility
Processes complex multilayer structures without delamination damage.
Cleaner Processing
Reduces debris redeposition for improved process cleanliness and stability.
Improved Device Reliability
Supports higher long-term device performance and operational reliability.
Higher Manufacturing Yield
Delivers more consistent processing with significantly improved production yield.
AquaLase is redefining precision laser processing for advanced semiconductor and photonics manufacturing, enabling cleaner processing, higher yield, and lower-damage manufacturing at scale.
Engineering the Future
Why AquaLase
AquaLase enables next-generation semiconductor and photonics manufacturing through high-yield, low-damage laser processing engineered for advanced materials, difficult wafer structures, and scalable industrial integration.
Precision
Reduced Material Damage
AquaLase® stabilises thermal gradients during laser processing to minimise cracking, chipping, and stress-induced wafer damage across advanced materials.
Yield
Higher Manufacturing Performance
Cleaner processing and improved process stability enable higher manufacturing yield, reduced waste, and greater production consistency.
Integration
Industrial Platform Compatibility
Designed for seamless integration with existing laser systems, AquaLase® enables scalable adoption without major disruption to manufacturing workflows.
Capability
Advanced Material Processing
Engineered for difficult-to-process semiconductor and photonics materials, including thick wafers and complex multilayer device structures.